A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded In the case of 150

In the case of 150 mm wafers

The test condition such as fluid

the issue is control of film thickness variation introduced by nanotopography

향상된 캐리어(carrier) 핸드오프(handoff) 병렬 I/O 인터페이스는 능동 장비를 사용하여 수동 장비에서 주고 받는 캐리어(carrier)의 핸드오프(handoff)를 컨트롤(controls)한다

<measured qualification parameter>

A00200 - SEMI A2 - Specification for Surface Mount Assembler Smart Hookup (SMASH) Revision:SEMI A2-1019 - Superseded In the case of 150The purpose of this Standard is to provide a standardized automation interface specification to be used for the equipment control in an assembly line for printed circuit board (PCB) that uses surface mount technology (SMT). The purpose of this Standard is to provide an interface specification that replaces conventional electrical interface with a network connection and adds data communication capability. The scope of this Standard is to define an