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G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced based on the gas and
G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced based on the gas and
$150.00
Description
based on the gas and the needed flow
capacitance
List your personality type and the corresponding traits
will be defined in the present document
mold manufacturers
G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages StdDcs-Replaced based on the gas andThis specification defines the acceptance criteria for ceramic pin grid array packages produced utilizing pressed ceramic, mechanically inserted pins and solder for electrical interconnection of pins. Referenced SEMI Standards None.
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