G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes StdTpc-Equipment Models 본 버전은 global Audits and

본 버전은 global Audits and Reviews Subcommittee 에 의해 2013년 6월 4일 간행이 승인되었다

SEMI G71-0996 (Reapproved 0811)

This Specification is intended to be used with the polished wafer specification (SEMI M1) and the epitaxial wafer specification (SEMI M2)

If wafer and stage cleanness is maintained

SEMI E58 ¾ Automated Reliability

G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes StdTpc-Equipment Models 본 버전은 global Audits andNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard specifies the requirements for plating layers on leadframes intended for use at the upcoming inspection. The specifications and test procedures detailed in this Standard apply to the internal section of