Advanced Packaging including Heterogeneous Integration & Chiplets 6/8 ElnTpc-Safety - Facility/Workplace and provide reference for various

and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers

1 The purpose of this Specification is to define a secure

2-0621 (Reapproved 0925)

SEMI MF1451 — Test Method for Measuring Sori on Silicon Wafers by Automated Non-contact Scanning

Member          $1295 $1195

Advanced Packaging including Heterogeneous Integration & Chiplets 6/8 ElnTpc-Safety - Facility/Workplace and provide reference for variousAdvanced Packaging incl. Heterogeneous Integration & Chiplets Dates & Times June 8th June 9th 7: 30 11: 30 PT Early Bird Pricing $100 off Member $845 $745 Non Member $ 945 $845 Location Virtual This one day course addresses IC packaging, assembly, and package substrate and Heterogeneous Integration & Chiplets. It stresses the impact of the IC and end product requirements, i. e., smaller, better, cheaper and their influence on the manufacturing