G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded SEMI D19-1019 (technical revision)

SEMI D19-1019 (technical revision)

The purpose of this Standard is to provide recommendations for defining a comprehensive training system for both suppliers and users of equipment for the semiconductor and related industries

Standardization of these component interfaces will allow for interchangeability of gas distribution system components

Static-control methods can be incorporated in the factory design to reduce static charge to acceptable levels

This Standard assumes that the GEM fundamental requirements and selected additional capabilities (as specified in § 13) have been implemented on the IBSEM equipment

G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded SEMI D19-1019 (technical revision)The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die bonding process. This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds