Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working

Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System WorkingRudolph Technologies AT SM Die Prep Kit F30 300mm Wafer Defect System Working Inventory # A 19531 Model No: AT SM Die Prep Kit Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Included Components Part No: 734202, Rev. A Part No: F30 Chuck O Ring Part No: Retaining Nut NSK Part No: HGP NZ1 NKS Part No: AFE CA, X Y AXIS NKS Part No: LG2, Z AXIS This Rudolph Technologies AT SM Die Prep Kit is used working surplus.

img{max-width:100%} Cabletron Systems 9000342-04 Processor PCB Card Lumonics LW-CO2 Used Working

CE Marked This GE Fanuc CQPICTDE0000-A Panel PC is used working surplus

4 KLA-Tencor CRS-1010S Used

Range/Gas: 75 SCCM

5080-193409-11: SPACER TK006-01-038-0 (Qty

Removed from a Hitachi MU-712E Shallow Trench Etcher System

img{max-width:100%}  SVG Silicon Valley Group 851-8220-011 Processor PCB Card Rev

Inventory # G7802

Eprom 1: IDAC2 Log

Part No: 710-650879-20

5010-203089-11 FLANGE (Qty

PCB Part No: JANCD-NTU01-1