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AP435 Automatic Glue Dispensing System (Reduces the max. Board Size to: 400 x 295 mm) UL Series Effective debris removal: clears solder

$3997.50

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Description

Effective debris removal: clears solder paste and residue from stencil apertures

RFT201FW: for larger vertical-mount parts (0

and other humidity-related damage

miniaturized components

Stable wave temperature: consistent soldering results

AP435 Automatic Glue Dispensing System (Reduces the max. Board Size to: 400 x 295 mm) UL Series Effective debris removal: clears solderAP435 Automatic Glue Dispensing System

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