Semiconductor devices. Mechanical and climatic test methods - Solderability algolia-ignore Designer of cableway installations

Designer of cableway installations

The sampling procedures and the methods of test for verification of conformity to the requirements of this standard are also specified

ISO 13851 discusses safety regarding two-hand control devices (THCD)

• Liaisons with existing schemes

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Semiconductor devices. Mechanical and climatic test methods - Solderability algolia-ignore Designer of cableway installations1 Scope This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin lead (SnPb) or lead free (Pb free) solder for the attachment. This test method provides a procedure for dip and look solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability